title: COSEL Power Supply, Noise Filter 2025 Product Catalog

Summary

COSEL Power Supply, Noise Filter 2025 Product Catalog

DCS-seriesPin Configuration? DCS1400B1-VIN2+VIN3RCG4RC17ITRM16AUX15PG14CB13VTRM12+S11-S109 -VOUT8765+VOUT4×FGNO.Pin ConnectionFunction1-VIN-DC input2+VIN+DC input3RCGRemote ON/OFF (GND)4RCRemote ON/OFF5 6 7+VOUT+DC output8 9 0-VOUT-DC outputa-SRemote sensing (-)∫+SRemote sensing (+)cVTRMAdjustment of output voltage∂CBCurrent balance´PGPower good output?AUXAuxiliary output for PGcITRMAdjustment of constant currentxFGMounting hole (FG)DCSImplementation・Mounting MethodMounting method!Use with the conduction cooling (e.g. heat dissipation from the aluminum base plate to the attached heat sink).!Use a heat sink that larger than the power supply and has a large thickness so that the alminum base plate can be cooled uniformly.!The unit can be mounted in any direction. When two or more power supplies are used side by side, position them with proper intervals toallow enough air ventilation. Aluminum base plate temperature of each power supply should not exceed the temperature range shown in“derating”.!Avoid placing the DC input line pattern layout underneath the unit. It will increase the line conducted noise. Make sure to leave an ampledistance between the line pattern layout and the unit. Also avoid placing the DC output line pattern underneath the unit because it mayincrease the output noise. Lay out the pattern away from the unit.!Avoid placing the signal line pattern layout underneath the unit because the power supply might become unstable. Lay out the patternaway from the unit.!High-frequency noise radiates directly from the unit to the atmosphere. Therefore, design the shield pattern on the printed circuit boardand connect it to FG. The shield pattern prevents noise radiation.!When a heat sink cannot be fi xed on the base plate side, order the power moduleMounting holewith“-T”option. A heat sink can be mounted by affi xing a M3 tap on the heat sink. Standard M3 tappedPlease make sure a mounting hole will be connected to a grounding capacitor CY. Optional : -T f3.4 thruStress onto the pins!When too much stress is applied to the pins may damage internalconnections. Avoid applying stress in excess of that shown in rightfi gure.!The pins are soldered onto the internal PCB.Therefore, Do not bend or pull the leads with excessive force.!Fix the unit on PCB (fi xing fi ttings) by screws to reduce the stress tothe pins. Be sure to mount the unit fi rst, then solder the unit.Soldering temperature!Flow soldering : 260C for up to 15 seconds.!Soldering iron (47W) : 450Cfor up to 5 seconds.? DCS1400B+VIN, -VIN, +VOUT, -VOUTLess than39.2N(4kgf)Less than39.2N(4kgf)Less than39.2N(4kgf)Less than19.6N(2kgf)OthersLess than19.6N(2kgf)Less than19.6N(2kgf)DCS-4? 534 ?