Summary
COSEL Power Supply, Noise Filter 2025 Product Catalog
DC-DC Converters PCB Mount TypeMG1R5, MG3, MG6, MG10Instruction Manual6 Safety Standards!To apply for a safety standard approval using the power supply,please meet the following conditions. Please contact us for details.?Please use the unit as a component of an end device.?The area between the input and the output of the unit is isolatedfunctionally. Depending upon the input voltage, basic insulation,dual insulation or enhanced insulation may be needed. In suchcase, please take care of it within the structure of your end-device.Please contact us for details.?Safety approved fuse must be externally installed on input side.7 TemperatureMeasuring Point!Please have suffi cient ventilation to keep the temperature of pointA in Fig.7.1 at Table7.1 or below. Please also make sure that theambient temperature does not exceed 85C.8.1 MG1R5/MG3 Lifetime expectancy dependson stress by temperature difference!Product lifetime expectancy depends on case temperature difference(Tc) and number of cycling in a day is shown in Fig.8.1,Fig.8.2 (It is calculated based on our accelerated process test result.)If case temperature changes frequently by changing outputload factor etc., the above the lifetime expectancy design shouldbe applied as well. And point A which is shown in Fig.8.3 mustkeep below 110C.Lifetime expectancy [years]15101time ON/OFF/1day52times ON/OFF/1day3times ON/OFF/1day4times ON/OFF/1day5times ON/OFF/1day025 30 35 40 45 50 55 60 65 70 75 80Rise/fall temperature difference at point ATc [C]Fig.8.1 Lifetime expectancy against rise/fall temperature difference (MG1R5)Point A (Center of the Case)Fig.7.1 Temperature Measuring Point on the case (Top View)Table 7.1 Point A TemperatureModelMG1R5MG3MG6MG10Point A110C110C105C105CLifetime expectancy [years]15101time ON/OFF/1day52times ON/OFF/1day3times ON/OFF/1day4times ON/OFF/1day5times ON/OFF/1day025 30 35 40 45 50 55 60 65 70 75 80Rise/fall temperature difference at point ATc [C]8 Lifetime expectancy depends onstress by temperature differenceFig.8.2 Lifetime expectancy against rise/fall temperature difference (MG3)Point A (Center of the Case)!Regarding lifetime expectancy design of solder joint, followingcontents must be considered. Be careful that the soldering jointis not stressed by temperature rise and down which occures byself-heating and ambient temperature change. The stress is acceleratedby thermal-cycling, therefore the temperature differenceshould be minimized as much as possible if temperature rise anddown occures frequently.Fig.8.3 Temperature Measuring Point on the case (Top View)!The warranty period is basically 10 years, however it depends onthe lifetime expectancy which is shown in Fig.8.1, Fig.8.2 if it isless than 10 years.MG-51