Application Guide Handling of Open Frame Type power supplies
Handling instruction for rugged Open Frame Type power supplies are different from those of Enclosed Type (with chassis) power supplies. Please keep the following points in mind when handling Open Frame Type units.
(1)After the load test
After a load test or Hi-Pot test, high voltage may remain inside the power supply. If the power supply is placed on a metal plate while residual voltage is present, exposed solder surfaces may cause a short circuit, resulting in degradation of the unit or potential electric shock.
(2)Mechanical stress
When assembling the power supply, avoid applying mechanical stress to the components or solder joints, as this may cause damage to the power supply.
(3)Notes when maintenance
After a load test or Hi‑Pot test, high voltage may remain inside the power supply. If the power supply is placed on a metal plate while residual voltage is present, exposed solder surfaces may cause a short circuit, resulting in degradation of the unit or potential electric shock.
(4)Insulation distance
When installing the power supply on a metal chassis, maintain the required insulation distance between component leads and the metal chassis. The required insulation distance is specified in the relevant section of the product documentation.
If the distance cannot be secured, it is recommended to insert an insulation sheet between the power supply and the metal chassis.
